AMD has revealed some technical details about 3D V-Cache technology, which allows existing processors to add large amounts of cache memory.
Recall that AMD has already shown a modified Ryzen 9 5900X, and processors with 3D V-Cache will appear on sale either at the end of this year or at the beginning of next.
So, the development of AMD is based on the TSMC SoIC packaging technology, which makes such expansion of crystals along the vertical axis possible. At the same time, not microprotrusions, as previously assumed, are used to connect the crystals to each other, but the TSV (Through Silicon Vias) technology, which IBM introduced back in 2007. It allows the components of the chips to be placed very close to each other.
True, to implement all these technologies, AMD had to literally turn the processor chiplets upside down and remove some of the silicon (AMD talks about removing 95% of the die thickness). Only then is the SRAM chip attached to the upper part of the chiplet, which was previously the lower one, which acts as a cache memory expander.
This solution can significantly reduce the distance between the additional cache and the chiplet. More precisely, it is 1000 times less than if the cache was added not on top, but on the side of the main chip. This, in turn, has reduced power consumption, temperatures, and latency.
The power consumption of the Radeon RX 7000 series graphics cards will not be as huge as that of the GeForce RTX 40
Rumors are actively attributing huge power consumption up to 600 W and even higher to GeForce RTX 40 video cards. Radeon RX 7000 cards will also consume more than the current generation.
AMD Senior Vice President Sam Naffziger revealed some details about the RDNA 3 architecture and products based on it. He also touched upon the topic of energy consumption.
The demand for gaming and computing performance is increasing, while at the same time the development of technical processes is slowing down quite sharply. Thus, the power level will only increase. We now have a multi-year roadmap with very significant energy efficiency improvements to offset this curve, but the trend is there.
Performance is critical, but even if our designs are more energy efficient, that doesn’t mean we won’t raise power levels if competitors are doing the same. They’ll just have to raise them much higher than us.
Thus, the Radeon RX 7000 line, despite the previously stated 50 percent advantage (over the RX 6000) in power efficiency, will stand out for its high power consumption simply because of the huge performance boost. At the same time, AMD is confident that Nvidia will have to increase power consumption even higher.
For now, the RX 6000 line is more power efficient than the GeForce RTX 30, although the difference isn’t huge. Previously, there were rumors that the top-end RX 7900 XT will consume 450 watts versus 600 watts in the case of the RTX 4090, but so far these are just rumors.
Who will release the weakest modern video card? GeForce GTX 1630, claiming this title, will be released on June 28
The GeForce GTX 1630 graphics card may hit the market on June 28th. This was announced by the manufacturer of 3D-maps Colorful.
However, the source says that the date may change, and this is quite likely, given that Nvidia has already postponed the launch of the adapter twice.
The GTX 1630 will be the weakest video card from the current Nvidia line if we are talking about new products. Recall that it is based on the TU117 GPU with 512 CUDA cores, has 4 GB of memory and a 64-bit bus.
The performance of such an adapter will be very modest. Previously, there was evidence that the new product will be slower than the GeForce GTX 1050 Ti. This means that it will probably be weaker than the latest Intel Arc A380, which is 5-15% behind the GTX 1650.
Ryzen 6800U and Radeon 680M: Aya Neo is preparing another portable console – Flip clamshell
Chinese manufacturer AyaNeo has announced the fifth handheld game console, which will be released in the fourth quarter of this year. This is a model called Flip, which is structurally similar to the Nintendo DS.
So far, there are no special details about the new product. It is only known that the console will receive an 8-core and 16-thread Ryzen 7 6800U (Zen 3+) with a frequency range from 2.7 to 4.7 GHz. Integrated graphics – Radeon 680M architecture RDNA 2. The device will also receive a 7-inch display. Also, judging by the published image, AyaNeo Flip will receive analog sticks and rear triggers.
Note that the company has already announced the release of AyaNeo 2, AyaNeo 2 Geek, AyaNeo Air and AyaNeo Slide. The latest version, by the way, is made in the slider form factor. There, a full-fledged keyboard is hidden under the screen.
There is no information about the start date of sales yet, the price and configuration options are also unknown.
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