A few days ago, the iPhone 15 Pro Max unexpectedly failed a durability test from the famous blogger JerryRigEverything. Now it’s the turn to try out the new generation of junior iPhones.

If we get straight to the point, both the iPhone 15 and iPhone 15 Plus passed the bending test without any problems, like many generations of Apple smartphones before. For the iPhone 15 Pro Max, we recall that when force was applied, the back glass burst, which may be due to the greater strength of the titanium frame.

At the same time, the iPhone 15, like the older model, received the same unusually hard protective glass on the front. The material, with a hardness rating of 6 on the Mohs scale, leaves virtually no marks on it, something no other mainstream smartphone can offer, and it is not yet known how Apple achieved this.

iPhone 15 smartphones, among other things, sometimes seem to suffer from excessive heating. This is especially true for the Pro versions equipped with the most advanced three-nanometer A17 Pro platform. However, the problem does not seem to be with the platform. At the very least, insider and TF International Securities analyst Ming-Chi Kuo blames another aspect.

According to him, the issue is in the cooling system of smartphones in general. The overheating is likely caused by “thermal design compromises” that allowed Apple to reduce the weight of the iPhone 15 Pro and 15 Pro Max models. Kuo says the reduced heat dissipation area and titanium body negatively impacted heat dissipation efficiency.

Indeed, if you look at the disassembled new products, there is no dedicated cooling system with an evaporation chamber or heat pipes. However, like previous generations of iPhone.

High-quality images of the new budget Xiaomi smartphone – Redmi 13C – have appeared on the Internet. As the name suggests, this model will replace the Redmi 12C, the basic version of which costs only $95 in China.

There is no data on the characteristics of the new product. We can only say that the resolution of the main sensor of the main camera will be 50 megapixels. There will also be a standard jack for connecting wired headphones. The new product will be offered in three colors: green, black and blue.

In terms of specifications, the Redmi 13C will not be much better than the Redmi 12C. Let’s remember that the current model is built on SoC MediaTek Helio G85, equipped with a 50-megapixel camera, a 6.71-inch screen and a 5000 mAh battery with support for 10 W charging.