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Samsung’s first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

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Samsung usually hosts a big Unpacked event in August, and 2022 seems to be no exception. The company is due to unveil its flagship foldable smartphone, the Galaxy Z Fold4, which could look like the images below.

Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

The images are conceptual, but they are in the spirit of past visualizations. From the current Galaxy Z Fold3, the novelty will differ in the performance of the main camera (in the spirit of the Galaxy S22 Ultra) and, probably, in other proportions, since the outer screen, according to rumors, will become shorter and wider.

Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images
Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

Galaxy Z Fold4 will receive a top Qualcomm SoC, and this will most likely be the recently introduced Snapdragon 8 Plus Gen 1. There will be support for the stylus, but Android 13 is available, as the source says, there are big doubts: this Galaxy Z Fold4 OS, of course the same, it will receive, but not out of the box, but with an over-the-air update around the first quarter of 2023. And the first smartphones with pre-installed Android 13 will be the Google Pixel 7 and Pixel 7 Pro coming out in the fall.

Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

Samsung's first Snapdragon 8 Plus Gen 1 flagship. Galaxy Z Fold4 shown in concept images

As for Samsung, in August, along with the Galaxy Z Fold4, it is expected to introduce the Galaxy Z Flip4 clamshell smartphone.

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1.2 million kilometers without changing the battery with zero risk of spontaneous combustion. Manufacturer praises BYD Blade

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12 million kilometers without changing the battery with zero risk

This week, BYD said in an investor communication that BYD Blade’s state-of-the-art battery packs can be charged and discharged more than 3,000 times. This allows you to cover 1.2 million kilometers without changing batteries.

BYD previously said its new BYD Blade vehicle battery will be a game-changer and usher in a new era of safety and performance for the electric vehicle industry.

In last year’s ranking of global battery manufacturers, BYD’s total installed battery capacity in electric vehicles reached 26.3 GWh. This allowed BYD to take the fourth place in the world with a market share of 8.8%.

1.2 million kilometers without changing the battery with zero risk of spontaneous combustion.  Manufacturer praises BYD Blade

Today, all BYD vehicles powered by new energy sources are equipped with BYD Blade batteries. Sales of all models such as Han, Tang, Song and Dolphin have exceeded 10,000 units in China alone.

In addition, the batteries have passed numerous tests, which have confirmed that they do not suffer from the problem of spontaneous combustion, even if the shell and geometry are damaged.

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It will replace the Passat. Volkswagen ID introduced. AERO

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It will replace the Passat Volkswagen ID introduced AERO

Volkswagen introduced the ID sedan. AERO, which is built on the pure electric MEB platform. In addition, the dimensions and technical parameters were disclosed.

The car received a body with a drag coefficient of only 0.23Cd. Volkswagen ID. AERO is positioned as a mid-size sedan, its length, width and height are 4975, 189 and 1528 mm, respectively. Thanks to the advantages of a purely electric platform, its wheelbase reaches almost 3 m (2966 mm). According to Volkswagen’s official statement, it has an interior space comparable to the Phaeton.

It will replace the Passat.  Volkswagen ID introduced.  AERO

Volkswagen ID. AERO uses a new interior design. The car uses a lot of straight lines. The LCD instrument panel is hidden in the center console, it also received a large floating center screen, while the car has almost no physical buttons.

Hidden under the floor of the sedan is a lithium-ion battery with a capacity of 77 kWh, which provides a range of up to 620 km on the WLTP cycle. 150 kW fast charging will also be supported.

It will replace the Passat.  Volkswagen ID introduced.  AERO

It is reported that the Volkswagen ID. AERO will be the model that will replace the Passat in the future.

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“It is often said that there is not enough chips, but most of all, engineers are missing.” Japan’s largest chip makers face shortage of specialists

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It is often said that there is not enough chips

Japan’s largest semiconductor makers, from Toshiba to Sony, have warned that a shortage of engineers is threatening the government’s efforts to revive the domestic chip industry.

The expected labor crisis comes as Japan works to increase investment in the semiconductor sector as part of efforts to bolster its economic security amid the chip shortage caused by the Covid-19 pandemic.

In an address to the Ministry of Economy, Trade and Industry last month, the electronics industry group said that over the next few years, Japan has the best chance of regaining its position in the semiconductor market.

“It is often said that there is not enough chips, but most of all, engineers are missing.”  Japan's largest chip makers face shortage of specialists

The Japan Electronics and Information Technology Manufacturers Association said the sector’s success depends on attracting enough people to innovate and run chip factories. It is estimated that eight major manufacturers will need to hire about 35,000 engineers over the next 10 years to keep up with the pace of investment.

“It is often said that there is not enough chips, but most of all, there is not enough engineers,” said Hideki Wakabayashi, a professor at the University of Tokyo and head of the policy proposal task force at the JEITA Semiconductor Committee.

To support innovation and search for potential employees, Toshiba, Sony and other companies are collaborating with the best scientific departments across the country and investing additional resources in chip research and recruitment.

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