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Samsung and Western Digital to work together to standardize and implement next-generation storage technologies

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Samsung Electronics and Western Digital announced today that they have signed a Memorandum of Understanding (MoU) that aims to “uniquely collaborate on the standardization and widespread adoption of next-generation data hosting, processing and switching (D2PF) technologies.” To begin with, the parties intend to focus on harmonizing their efforts and building a strong ecosystem for Zoned Storage solutions. These moves are expected to allow the industry to focus on countless applications that will ultimately bring great value to customers.

Samsung and Western Digital to work together to standardize and implement next-generation storage technologies

This is the first time that Samsung and Western Digital have teamed up as technology leaders to ensure broad alignment and raise awareness of important storage technologies. The partnership, focused on enterprise and cloud applications, is expected to drive collaboration in technology standardization and software development for D2PF technologies such as Zoned Storage. As a result, consumers can be confident that these storage technologies will be supported by multiple device vendors as well as vertically integrated hardware and software companies.

“Storage is an important foundation for how people and companies consume and use data. To meet today’s needs and deliver tomorrow’s next big ideas, we must innovate, collaborate, and keep pace as an industry with new standards and architectures,” said Rob Soderbery, Executive Vice President and General Manager Flash Business Unit at Western Digital. “For a technology ecosystem to be successful, common structures and common decision models must be brought together so that they don’t suffer from fragmentation that delays adoption and adds unnecessary complexity to software stack developers.”

Partners have already launched an initiative for Zoned Storage devices, including ZNS (Zoned Namespaces) SSD and SMR (Shingled Magnetic Recording) HDD. Through organizations such as the Storage Networking Industry Association (SNIA) and the Linux Foundation, Samsung and Western Digital will define high-level models and platforms for next-generation zoned storage technologies. In addition, this collaboration is expected to serve as a starting point for expanding zone-based device interfaces (eg, ZNS, SMR) as well as next-generation mass storage devices with advanced data placement and processing technologies. At a later stage, these initiatives will be expanded to include other new D2PF technologies such as compute storage and storage fabrics, including NVMe-oF.

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Software

Windows 11 22H2 (Sun Valley 2) RTM Released May 24th

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Windows 11 22H2 Sun Valley 2 RTM Released May 24th

Sources say that the Windows 11 22H2 update, codenamed Sun Valley 2, will soon reach pre-release status. The source writes that this will happen this month.

According to Neowin, well-known insider WalkingCat has revealed the exact release date for Windows 11 22H2 RTM. He claims that it will be released on May 24th. It is worth noting that the RTM (release to manufacturing) version, although it indicates a certain degree of product readiness, is not final. According to rumors, the final version of the update will be released between September and November.

Windows 11 22H2 (Sun Valley 2) RTM Released May 24th

Notably, May 24 is also the start date for the Microsoft Build 2022 conference, which will run for three days. During the conference, the Redmond giant will present its latest tools, technologies and updates for various software products.

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Electric Cars

15.6″ bezel-less screen, 326 hp, autopilot and NFC support. Details about the new crossover Chery and Huawei

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156 bezel less screen 326 hp autopilot and NFC support Details

Chery has released details on the specifications of the Jetour Dasheng crossover, which was co-developed with tech giant Huawei.

Jetour Dasheng in the basic version is equipped with a 1.5-liter engine with 156 hp, which works with either a 6-speed “mechanics” or a “robot” with two clutches. Also in the lineup will be a 1.6-liter engine with 197 hp, which works with a preselective “robot”. D in both cases, the drive is front.

15.6

The older all-wheel drive hybrid version with the Kunpeng DHT installation, which consists of a 1.5-liter turbocharged engine and two electric motors, will produce a total of 326 hp. power. The battery capacity is 19.27 kWh. A car can only travel 100 km on electricity, which is a lot for a hybrid. With the combined operation of internal combustion engines and electric motors, fuel consumption is only 1 liter per 100 kilometers.

15.6

In the cabin of Jetour Dasheng there is a large horizontally oriented tablet without frames, the diagonal of which is 15.6 inches. The 8-inch digital instrument cluster screen is located in front of the driver. In the basic version, Jetour Dasheng is equipped with an augmented reality projection display.

The touch-sensitive climate control buttons are placed on the doors, and a retractable footrest is provided for the front passenger. Contactless door opening using a smartphone and NFC technology has also been announced. The car will offer adaptive cruise control, and later Huawei will implement Level 3 Autopilot, which allows you to take your hands off the wheel.

15.6

The launch of Jetour Dasheng sales in China is scheduled for the second half of 2022.

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The US and the EU want to prevent a “subsidy race” for the production of chips

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The US and the EU want to prevent a subsidy

The United States and the European Union will announce a joint effort to prevent a “subsidy race” as they struggle to increase production of scarce semiconductor chips. The move will be unveiled at the second meeting of the US-EU Trade and Technology Council (TTC).

At its inaugural conference last year in Pittsburgh, the TTC pledged to deepen transatlantic cooperation to strengthen chip supply chains, curb China’s non-market trade practices and adopt a more unified approach to regulating major global technology companies.

“You will see us announce a transatlantic approach to semiconductor investment focused on security of supply,” a senior administration official told reporters in a phone call Friday ahead of the meeting. Both Washington and Brussels want to encourage chip investment, and “do it in a coordinated way, not just encourage a subsidy race.”

The US and the EU want to prevent a

A constant shortage of chips has disrupted production in the automotive and electronics industries, forcing some firms to cut production. But a US law that would give chipmakers $52 billion in funding to expand production has stuck in Congress.

The official said an early warning system to detect and fix disruptions in the semiconductor supply chain will also be announced as part of the meeting, which will be chaired by Secretary of State Anthony Blinken, Secretary of Commerce Gina Raimondo and US Trade Representative Catherine Tai. EU Trade Head Valdis Dombrovskis and EU Antimonopoly Authority Head Margrethe Vestager will also attend, the official said.

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