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Renesas develops next generation microcontrollers supporting Bluetooth 5.3 specification with Low Energy

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Renesas Electronics recently announced the development of a new generation of microcontrollers that will support the recently adopted Bluetooth 5.3 Low Energy (LE) specification. They will join the Renesas Advanced (RA) family of 32-bit Arm Cortex-M microcontrollers, joining the RA4W1 Bluetooth 5.0 LE microcontrollers introduced last year. Renesas expects to receive the first samples of the new microcontrollers in the first quarter of 2022.

The development will use Renesas’ extensive experience in creating microcontrollers with Bluetooth LE support. The new microcontrollers will be supported by a flexible software package (FSP) of the RA family to simplify application development; the Renesas QE plug-in for Bluetooth LE; and a dedicated Bluetooth profile.

Renesas plans to offer several kits based on new microcontrollers, which will include analog microcircuits, power and timing controllers. The kits offer an easy-to-use architecture, simplifying the design process and significantly reducing design risks, the company says.

The manufacturer said the new microcontrollers are being developed with an advanced manufacturing process in mind, but did not specify which one, confining themselves to assurances that it will provide “high performance, low power consumption and small size.” Samples of new microcontrollers, as already mentioned, should become available in the first quarter of 2022.

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Phones

Apple, Samsung and Xiaomi smartphones cannot do that. There was a video with the disassembly process of the modular Fairphone 4 and strength tests

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The modular and most maintainable smartphone Fairphone 4 fell into the hands of blogger JerryRigEverything.

In this case, we are interested not only in his strength tests, although there is usually only one useful of them, but also in the video of the disassembly process.

As you can see, the smartphone is disassembled and assembled as easily as possible, and even the display is dismantled simply by unscrewing a few bolts. There is no need to talk about the simplicity of the battery replacement process. No other device in this segment offers this.

At the same time, modularity did not affect the strength in any way. Thanks to the metal frame, the smartphone practically does not bend, which is very good. The plastic of the back cover does not suffer from this effect either.

Recall that Fairphone 4 is based on SoC Snapdragon 750G and is equipped with an IPS screen, 48-megapixel main camera and a 3905 mAh battery.

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Phones

Google makes life easier for Android TV owners by adding the ability to install apps from a smartphone

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Google has made life easier for Android TV owners. These users can now install applications on their TVs directly from their smartphones.

To install, just go to Google Play from your smartphone and select a TV from the drop-down list as the target for installing the software. Similarly, Google has implemented the installation of applications on smartwatches with Wear OS.

Google makes life easier for Android TV owners by adding the ability to install apps from a smartphone

This approach allows, firstly, to install the application faster and easier, since it is still easier to do all the manipulations from a smartphone, and secondly, in this way, you can install the application remotely without being in front of the TV.

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Components

Computer in “credit card” format. Qualcomm develops Qompute Card concept despite Intel’s failure

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Qualcomm is reportedly developing a concept called the Qompute Card.

It involves placing all the basic elements of a PC on one small board. This will allow you to easily and quickly update the configuration of such a PC or use such cards by one user in different places on different PCs. Also, a similar solution can find application in household appliances.

The concept is not new at all. Back in 2017, a similar idea for the Intel Compute Card was presented, but the company abandoned it two years later, since it did not receive any distribution in the market.

Qualcomm as a whole makes a very similar decision, except that the heart of such cards will be SoCs based on the Arm architecture. The Qompute Card will also contain the motherboard, RAM and flash memory. That is, all the main elements of the finished device. At the same time, Qualcomm cards may well be significantly smaller than Intel Compute Card, if only because of the different power consumption of SoC Snapdragon and conventional Intel CPUs.

Qompute Card are aimed specifically at computers and laptops. At least the SoC Snapdragon 7c + Gen 3 presented the other day will also be offered as part of the cards. The source adds that Qualcomm is testing configurations for both Windows Arm and Chrome OS. How successful this version will turn out to be, time will tell. So far, all such modularity initiatives have not met with success.

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