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Intel is building a blockchain accelerator
Intel has announced its desire to contribute to the development of blockchain technologies with the help of a roadmap for energy-efficient accelerators. Intel will enable and promote an open and secure blockchain ecosystem and promote the development of this technology in a responsible and sustainable manner.
We remember that some blockchains require a huge amount of computing power, which unfortunately leads to a huge amount of energy. Our clients need scalable and resilient solutions, which is why we have focused our efforts on realizing the full potential of blockchain by developing the most energy efficient and scalable computing technologies.
Our blockchain accelerator will be released later this year. We work directly with clients who share our sustainability goals. Argo Blockchain, BLOCK (formerly known as Square) and GRIID Infrastructure are some of our first clients for this future product. This architecture is implemented on a tiny piece of silicon, so it has minimal impact on the delivery of current products.
Intel Labs has spent decades researching strong cryptography, hashing techniques, and ultra-low voltage circuits. We expect our circuit innovations to create a blockchain accelerator with over 1,000 times the performance per watt of conventional SHA-256 mining GPUs.
To support this and additional new technologies, we have formed a new Custom Compute Group within the Intel Accelerated Computing Systems and Graphics business unit. The goal of this team is to create custom silicon platforms optimized for customer workloads, including blockchain and other custom accelerated supercomputing capabilities at the edge.
Simply put, Intel is developing some kind of hardware solution to accelerate the blockchain. It is not clear in what form it will accelerate the blockchain, but the company emphasizes that it will be as energy efficient and safe as possible. Considering that Intel is going to release a product this year, the development has clearly been going on for a long time, so the details will not be long in coming.
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News
“Some of our clients didn’t believe the data until they put it to the test.” HBM3 Gen2 memory is already being tested by Nvidia

Micron has already started shipping HBM3 Gen2 memory to Nvidia, and the testing results seem to be very impressive.
The memory is being supplied for testing only: mass production apparently has not yet begun. However, it is already clear that new memory can significantly speed up products that will use it.
In the hands of our customers we have samples that, compared to those of our competitors, simply amaze everyone.
In fact, power consumption is so much lower with higher performance that some of our customers didn’t believe the data until they put it to the test.
Micron Business Director Sumit Sadana
Unfortunately, Micron has not yet presented any indicators, although we have data from the announcement. Let’s remember that we are talking about 24 GB of memory per stack with a throughput of more than 1.2 TB/s and energy efficiency two and a half times higher than the previous generation of HBM.
HBM3 Gen2 memory is expected to be used in Nvidia Blackwell compute accelerators, which could appear as early as next year. Such memory is unlikely to appear in gaming video cards, although GDDR7 will also offer an impressive increase in performance compared to GDDR6X.
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China’s SMIC is only four years behind TSMC and Samsung, although US sanctions should keep the gap to 10 years

The Chinese company SMIC has recently become much more famous due to the fact that, as it turns out, it has mastered the 7 nm process technology and successfully released the Kirin 9000s SoC for the new flagship Huawei smartphones on it. A fresh report shows that SMIC is at most four years behind the semiconductor market leaders.
At the same time, US sanctions pressure was intended to keep China at a distance of 10 years from leaders, including TSMC and Samsung.
US authorities view the emergence of the Kirin 9000S as a serious threat. However, this cannot be said that sanctions do not work or that China will quickly close the existing gap. Bloomberg says Chinese companies, including SMIC, are finding it increasingly difficult to purchase advanced EUV lithography equipment. Such equipment is produced in large quantities and in a form suitable for the specified tasks, in fact, only by the Dutch ASML, and it is prohibited from selling installations to China. As a result, the transition from a 7 nm process technology to some more modern one, that is, at least 5 nm, may become an insurmountable obstacle for SMIC while sanctions are in effect.
At the same time, it recently became known that China is at least trying to create an advanced lithograph operating on a particle accelerator, which will be able to produce products at 2 nm standards.
News
Changan CS35 Plus Super Edition presented: two pedals, two screens and 160 hp. for 11 thousand dollars

The Changan CS35 Plus crossover is already inexpensive, but with the Super Edition it has become even more interesting: the price is lower, and the equipment is still at a high level. They presented the car in China, the cost was only 11 thousand dollars.
The crossover is equipped with a 1.4-liter Blue Whale line engine with a power of 160 hp. The engine is paired with a 7-speed robotic transmission with two wet clutches, the drive is exclusively front-wheel drive.
It is equipped with a multifunction steering wheel, a combined interior with red leather inserts, a digital instrument panel with a 9-inch screen and a media system with a 10.25-inch display, climate and cruise control. In general, all the necessary comfort options are there.
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