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Inexpensive Redmi K50 with Snapdragon 870 platform will be released Inexpensive Redmi K50 with Snapdragon 870 platform will be released

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Inexpensive Redmi K50 with Snapdragon 870 platform will be released in March

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Yesterday, Xiaomi introduced the top smartphone of the Redmi K50 line, but this is not the device that many were waiting for: after all, the Redmi K50 Gaming Edition is a niche model. Aimed at a wider audience, the regular members of the series were rumored to be released in March. And now these rumors were confirmed by the official representative of the company.

Inexpensive Redmi K50 with Snapdragon 870 platform will be released in March

Redmi K50 Gaming Edition

According to Wang Teng Thomas, former director of new product at Xiaomi and now head of one of the company’s regional offices, the base Redmi K50 will be released in March. It is logical to think that the two remaining models of the line – K50 Pro and K50 Pro + will be presented on the same stage with him. Recall that the base Redmi K50 is assigned the SoC Snapdragon 870, and the K50 Pro and K50 Pro + are expected to use the MediaTek platforms – Dimensity 8000 and Dimensity 9000.

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Software

Windows 11 22H2 (Sun Valley 2) RTM Released May 24th

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Windows 11 22H2 Sun Valley 2 RTM Released May 24th

Sources say that the Windows 11 22H2 update, codenamed Sun Valley 2, will soon reach pre-release status. The source writes that this will happen this month.

According to Neowin, well-known insider WalkingCat has revealed the exact release date for Windows 11 22H2 RTM. He claims that it will be released on May 24th. It is worth noting that the RTM (release to manufacturing) version, although it indicates a certain degree of product readiness, is not final. According to rumors, the final version of the update will be released between September and November.

Windows 11 22H2 (Sun Valley 2) RTM Released May 24th

Notably, May 24 is also the start date for the Microsoft Build 2022 conference, which will run for three days. During the conference, the Redmond giant will present its latest tools, technologies and updates for various software products.

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Electric Cars

15.6″ bezel-less screen, 326 hp, autopilot and NFC support. Details about the new crossover Chery and Huawei

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156 bezel less screen 326 hp autopilot and NFC support Details

Chery has released details on the specifications of the Jetour Dasheng crossover, which was co-developed with tech giant Huawei.

Jetour Dasheng in the basic version is equipped with a 1.5-liter engine with 156 hp, which works with either a 6-speed “mechanics” or a “robot” with two clutches. Also in the lineup will be a 1.6-liter engine with 197 hp, which works with a preselective “robot”. D in both cases, the drive is front.

15.6

The older all-wheel drive hybrid version with the Kunpeng DHT installation, which consists of a 1.5-liter turbocharged engine and two electric motors, will produce a total of 326 hp. power. The battery capacity is 19.27 kWh. A car can only travel 100 km on electricity, which is a lot for a hybrid. With the combined operation of internal combustion engines and electric motors, fuel consumption is only 1 liter per 100 kilometers.

15.6

In the cabin of Jetour Dasheng there is a large horizontally oriented tablet without frames, the diagonal of which is 15.6 inches. The 8-inch digital instrument cluster screen is located in front of the driver. In the basic version, Jetour Dasheng is equipped with an augmented reality projection display.

The touch-sensitive climate control buttons are placed on the doors, and a retractable footrest is provided for the front passenger. Contactless door opening using a smartphone and NFC technology has also been announced. The car will offer adaptive cruise control, and later Huawei will implement Level 3 Autopilot, which allows you to take your hands off the wheel.

15.6

The launch of Jetour Dasheng sales in China is scheduled for the second half of 2022.

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The US and the EU want to prevent a “subsidy race” for the production of chips

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The US and the EU want to prevent a subsidy

The United States and the European Union will announce a joint effort to prevent a “subsidy race” as they struggle to increase production of scarce semiconductor chips. The move will be unveiled at the second meeting of the US-EU Trade and Technology Council (TTC).

At its inaugural conference last year in Pittsburgh, the TTC pledged to deepen transatlantic cooperation to strengthen chip supply chains, curb China’s non-market trade practices and adopt a more unified approach to regulating major global technology companies.

“You will see us announce a transatlantic approach to semiconductor investment focused on security of supply,” a senior administration official told reporters in a phone call Friday ahead of the meeting. Both Washington and Brussels want to encourage chip investment, and “do it in a coordinated way, not just encourage a subsidy race.”

The US and the EU want to prevent a

A constant shortage of chips has disrupted production in the automotive and electronics industries, forcing some firms to cut production. But a US law that would give chipmakers $52 billion in funding to expand production has stuck in Congress.

The official said an early warning system to detect and fix disruptions in the semiconductor supply chain will also be announced as part of the meeting, which will be chaired by Secretary of State Anthony Blinken, Secretary of Commerce Gina Raimondo and US Trade Representative Catherine Tai. EU Trade Head Valdis Dombrovskis and EU Antimonopoly Authority Head Margrethe Vestager will also attend, the official said.

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