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Fastest XPG Unveils LANCER 7200 Series DDR5 RAM Fastest XPG Unveils LANCER 7200 Series DDR5 RAM

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Fastest: XPG Unveils LANCER 7200 Series DDR5 RAM

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Manufacturer XPG, which specializes in PC gaming components and accessories, announced the preparation of a series of XPG LANCER 7200 DDR5 RAM modules. This memory is equipped with Hynix A-die chips and operates at speeds up to 7200 MT/s.

Fastest: XPG Unveils LANCER 7200 Series DDR5 RAM

The LANCER 7200 series is available with or without RGB lighting. Modules up to 16 GB come with two heatsink colors: Midnight Black and Snow White.

Fastest: XPG Unveils LANCER 7200 Series DDR5 RAM

In addition, XPG also released a limited edition LANCER RGB 7200 DDR5 MERA. The modules are also available in sizes up to 16 GB and come in a dual channel version. The limited edition of MERA is equipped with ARGB backlight.

Fastest: XPG Unveils LANCER 7200 Series DDR5 RAM

XPG LANCER RGB ROG CERTIFIED 6400 modules are also announced. They run at a speed of 6400 MT / s with overclocking to 6600 MT / s. Claimed to be fully compatible with ROG motherboards of the Intel DDR5 series and support for overclocking. These modules will go on sale in November worldwide. The price has not yet been announced.

In addition, it became known that the new ADATA and XPG memory modules support the latest Intel Z790 platform.

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Confirmed: Xiaomi 13 gets Samsung’s best AMOLED screen

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Confirmed Xiaomi 13 gets Samsungs best AMOLED screen

Today, another official teaser dedicated to Xiaomi 13 has appeared. It shows the flat screen of the smartphone, the same flat side frame and minimal screen frame. The inscription indicates that the phone received a Samsung AMOLED screen of the latest generation E6.

Confirmed: Xiaomi 13 gets Samsung's best AMOLED screen

Its feature (relative to the screen of the previous generation E5) is reduced power consumption with increased brightness. So, the maximum brightness on the street is 1200 cd / sq.m, and the peak reaches a value of 1900 cd / sq.m.

Recall that yesterday details about the Xiaomi 13 and Xiaomi 13 Pro camera and the memory configuration of these models became known, and today data on the cost of these phones leaked to the Web.

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31.5 inches, 240 Hz, Core i7 and GeForce RTX 3060. Colorful introduced a gaming monoblock

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315 inches 240 Hz Core i7 and GeForce RTX 3060

Colorful introduced an atypical candy bar called the iGame G-ONE Plus to the home market. The highlight of the device is the presence of a discrete GPU Nvidia GeForce RTX 3060.

31.5 inches, 240 Hz, Core i7 and GeForce RTX 3060. Colorful introduced a gaming monoblock

Yes, we are talking about a GPU for a laptop, not for a desktop PC (GDDR6 video memory is 6 GB), but since the vast majority of single-block computers running Windows do not have discrete graphics in principle, such an accelerator is not enough. iGame G-ONE Plus can even be called a gaming monoblock.

The base version of the computer has a Core i5-12500H processor and a 31.5-inch display with Full HD resolution and a frame rate of 240 Hz. For this version, they ask for the equivalent of $ 1,210. The top version for $1,640 has a Core i7-12700H and a 2K screen with a frame rate of 165Hz. The amount of RAM in the base is 16 GB, SSD – 512 GB.

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TSMC accelerates commissioning of its cutting-edge US plant and plans to recruit 1,000 more workers in 2023

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TSMC accelerates commissioning of its cutting edge US plant and plans

According to Taiwan Economic Daily, Taiwan Semiconductor Manufacturing Company (TSMC) is accelerating the commissioning of its largest and most advanced factory outside of Taiwan (to be located in Arizona, USA) and expanding its recruitment plans. Already in 2023, it is planned to recruit 1,000 people, so by the end of next year, the company will employ about 2,000 people.

TSMC accelerates commissioning of its cutting-edge US plant and plans to recruit 1,000 more workers in 2023

The construction of the plant began in the summer of 2021, and on December 6, equipment should begin to be delivered there. The start of commercial production of chips is scheduled for December 2023 (previously it was said about 2024), they will be produced using the 5 nm process technology. The monthly production capacity of the enterprise will be 20,000 semiconductor wafers.

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