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Disassembly of the new MacBook Pro showed in what unusual Disassembly of the new MacBook Pro showed in what unusual

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Disassembly of the new MacBook Pro showed in what unusual way Apple solved the problem of shortage of substrates

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Disassembly of the new MacBook Pro has already shown that the internal design of new products is almost identical to previous models. However, something has changed somewhat. The single-chip systems themselves have changed, and at the same time the radiator of the cooling system has decreased. And the reasons for this are quite curious.

Disassembly of the new MacBook Pro showed in what unusual way Apple solved the problem of shortage of substrates

M1 Pro left

As you can see, the M1 Pro SoC is much wider than the M2 Pro. The first has only two RAM chips, while the second has four. And the point here is not at all in the increased capacity.

Disassembly of the new MacBook Pro showed in what unusual way Apple solved the problem of shortage of substrates

Version with M1 Pro on top

The chief analyst at SemiAnalysis commented on the situation for the iFixit specialists, who took apart the new MacBook.

ABF substrates were in very short supply when Apple opted for the design. By using four smaller modules rather than two large ones, the company can reduce the complexity of routing within the substrate from memory to the SoC, resulting in fewer layers on the substrate. This allows them to further increase their limited supply of substrate.

Simply put, Apple was looking for a way not to be held hostage to the shortage of substrates and found a way in the form of increasing the number of memory chips while reducing the area of ​​the substrate. But whether it was worth reducing the radiator, full-fledged comparative tests will show.

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MSI CreatorPro X17 HX powerful mobile workstation introduced. With Core i9-13980HX, GeForce RTX 3500 Ada Laptop and Mini-LED 4K display

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MSI CreatorPro X17 HX powerful mobile workstation introduced With Core

After Nvidia officially announced new mobile 3D workstation accelerators based on Ada Lovelace architecture yesterday, MSI today unveiled its flagship CreatorPro X17 HX workstation with such graphics. More specifically, the laptop uses a dGPU GeForce RTX 3500 Ada Laptop with 12 GB of GDDR6 memory.

MSI CreatorPro X17 HX powerful mobile workstation introduced.  With Core i9-13980HX, GeForce RTX 3500 Ada Laptop and Mini-LED 4K display

Display – Mini-LED with a diagonal of 17.3 inches, a resolution of 3840 x 2160 pixels and a frame rate of 144 Hz. The display meets the requirements of the DisplayHDR 1000 standard and provides coverage of 100% of the DCI-P3 color space.

There are four slots for installing RAM, with a maximum of 128 GB of RAM. There are also two M.2 SSD slots, one of which supports PCIe 5.0.

Laptop configuration includes IR webcam, SteelSeries customizable RGB keyboard, fingerprint scanner, Wi-Fi 6E, Bluetooth 5.3, and 2.5 Gigabit Ethernet, four Dynaudio system speakers, two USB-C ports with Thunderbolt 4 , three USB 3.2 Gen2 Type-A, one each Mini DisplayPort and HDMI 2.1.

The battery capacity is 100 Wh. Notebook dimensions – 397 x 330 x 23 mm, weight – 3.3 kg.

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Lenovo Legion Y7000P 2023 gaming laptops introduced. Top version includes Intel Core i7-13700H and GeForce RTX 4060 Laptop

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Lenovo Legion Y7000P 2023 gaming laptops introduced Top version includes

Lenovo introduced the entry-level gaming laptop Legion Y7000P 2023. In fact, it is very similar in terms of parameters to the geekbook – Lenovo GeekPro G5000, but the Y7000P is positioned a little higher.

Lenovo Legion Y7000P 2023 gaming laptops introduced. Top version includes Intel Core i7-13700H and GeForce RTX 4060 Laptop

The Legion Y7000P 2023 is equipped with a 16-inch IPS screen with a resolution of 2560 x 1600 pixels, a frame rate of 165 Hz, and a brightness of 350 cd/m2. and covering 100% of the sRGB color space.

Lenovo Legion Y7000P 2023 gaming laptops introduced. Top version includes Intel Core i7-13700H and GeForce RTX 4060 Laptop

In the base there is an Intrel Core i5-13500H processor and a dGPU Nvidia GeForce RTX 4050 Laptop, and in the top version there is a Core i7-13700H and GeForce RTX 4060 Laptop. The amount of DDR5 RAM is 16 GB (two slots, so the amount of RAM can be increased), SSD – 1 TB.

Also in the configuration are Wi-Fi 6 and Ethernet 2.5 Gigabit adapters, a 140 W charger connected to the USB-C port, and an 80 Wh battery. Pricing hasn’t been announced yet, but this model shouldn’t be much more expensive than the GeekPro G5000.

Also today, Lenovo introduced the Lenovo Legion Y900 tablet (with 3K screen and 12,300 mAh battery) and its most powerful gaming laptop, the Legion Y9000P Extreme Edition.

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Components

24-core Core i9-13900HX and GeForce RTX 4090 Laptop. Legion Y9000P Extreme Edition unveiled – Lenovo’s most powerful gaming laptop

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24 core Core i9 13900HX and GeForce RTX 4090 Laptop Legion Y9000P

Lenovo today in China introduced a lot of new products, including the most powerful of gaming laptops – Legion Y9000P Extreme Edition. The top model has only the highest performance components: a 24-core Core i9-13900HX and a GeForce RTX 4090 Laptop.

24-core Core i9-13900HX and GeForce RTX 4090 Laptop.  Legion Y9000P Extreme Edition unveiled - Lenovo's most powerful gaming laptop

True, such a 3D accelerator is available only in the maximum configuration, for which, however, they ask for quite adequate $ 3,200. And the $2,615 base version uses a GeForce RTX 4080 Laptop.

Legion Y9000P Extreme Edition received a 16-inch screen with a resolution of 2560 x 1600 pixels and a frame rate of 240 Hz. It provides 100% sRGB color space coverage as well as Dolby Vision technology. The maximum brightness is 500 cd/m2, the screen also meets the requirements of the DisplayHDR 400 standard.

24-core Core i9-13900HX and GeForce RTX 4090 Laptop.  Legion Y9000P Extreme Edition unveiled - Lenovo's most powerful gaming laptop

The laptop received metal outer panels. The case thickness is 22-25.9 mm, the weight of the device is 2.7 kg.

The Legion Y9000P Extreme Edition received an improved cooling system, a backlit keyboard, Wi-Fi 6E and 2.5 Gigabit Ethernet adapters, 32 GB of DDR5-5600 RAM, a 1 TB PCIe 4.0 SSD, and an 80 Wh battery. Pre-sales in China will start on March 26.

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