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Dimensity 1200, 12 GB RAM, 108 MP and 65 W. This will be the Realme X9 Pro



Realme has confirmed that the company will be one of the first smartphone manufacturers to use MediaTek’s latest Dimensity 1200 SoC, announced earlier today.

This information was published by the CEO of Realme India Madhav Sheth, who previously published a photo of the future smartphone, which is part of the Realme X series.

The source reports that we are talking about the Realme X9 Pro smartphone, which will receive a Dimensity 1200 single-chip system, 12 GB of LPDDR5 RAM and 128/256 GB of flash memory. The phone should come out with Realme UI 2.0 based on Android 11.

It is also expected that the main image sensor will have a resolution of 108 megapixels, an additional 13-megapixel telephoto and a wide-angle camera will be installed. The smartphone will receive a 6.4-inch OLED display with a resolution of 1080 x 2400 pixels with a refresh rate of 120 Hz. The 4500mAh battery will support 65W fast charging.

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