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China will respond to US sanctions with the most advanced particle accelerator lithograph. With its help, China will be able to create 2-nanometer chips

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According to the South China Morning Post, China is exploring new possibilities for producing chips within the country. And one of these is an advanced lithograph operating on a particle accelerator. A team from Tsinghua University is already in active negotiations with the authorities of Xiongang New District in northern China’s Hebei Province to select a construction site for the cutting-edge project. The plan is to build a particle accelerator with a circuit length of 100–150 meters, in which the accelerator beam will turn into a high-quality light source for the production of very “thin” chips.

China will respond to US sanctions with the most advanced particle accelerator lithograph.  With its help, China will be able to create 2-nanometer chips

Unlike the world leader in the production of lithographs, the Dutch Advanced Semiconductor Materials Lithography (ASML), which advocates reducing the size of machines for making chips, the Chinese project involves the construction of a huge factory that will house several lithography machines around a single accelerator. This approach will ensure mass production and low cost of production of single-chip systems.

Currently, 7-nanometer chips are produced using EUV lithography, and ASML dominates the market with its machines (the company delivered 180 EUV lithographs last year, and should deliver 60 more this year). And although this technology is the most studied and, one might say, reliable, the Chinese decided to go a different route. Work on an alternative project at Tsinghua University under the leadership of Professor Tang Chuanxian has been going on since 2017, and Huawei is also participating in it. The key principle is the creation of a laser light source using steady-state microbunching (SSMB) technology. The principles of SSMB were first described by Professor Zhao Wu from Stanford University in 2010. Zhao is a former student of renowned physicist Yang Zhenning.

SSMB involves using the energy of charged particles as a narrow scattering radiation source. “The device can generate high-quality radiation from terahertz waves with a wavelength of 0.3 mm to EUV waves with a wavelength of 13.5 nm“, Zhao explained. In other words, SSMB provides an almost ideal light source that has a higher average power compared to EUV lithography

And although scientists understand the importance of their development for China, the creation of a working SSMB lithograph is not a prospect for the near future.

Our independent EUV lithography machine still has a long way to go, but SSMB-based EUV light sources give us an alternative to sanctioned technologies” said Professor Tan. “Developing a usable lithography system requires ongoing technological innovation based on SSMB light sources and collaboration with mining and processing industries.“, he added.

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V8 power like a Bugatti Veyron: Hennessey Cadillac Escalade-V presented

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V8 power like a Bugatti Veyron Hennessey Cadillac Escalade V presented

Hennessey has increased the power of the Cadillac Escalade-V SUV to the level of the Bugatti Veyron (from 1001 hp). Cadillac makes the all-electric Escalade IQ with 750 horsepower, but Hennessey has unveiled its own version of the gasoline SUV with a souped-up V engine.

V8 power like a Bugatti Veyron: Hennessey Cadillac Escalade-V presented

Following on from the H650 package released earlier this year, the Texas tuner has introduced the 1,005 hp Hennessey Cadillac Escalade-V. with 1193 Nm of torque.

The standard Escalade-V’s 6.2-liter supercharged V8 produces 682 hp. and 853 Nm. The more powerful Hennessey version gets a high-performance air intake system, a special camshaft, an upgraded exhaust system, high-performance catalytic converters and new intake valves. The H1000 kit comes with a three-year/60,000km warranty.

V8 power like a Bugatti Veyron: Hennessey Cadillac Escalade-V presented

The price of this version has not yet been announced.

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Unboxing and live photos of Redmi K70E – the first smartphone on SoC MediaTek Dimensity 8300-Ultra

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Unboxing and live photos of Redmi K70E the first

Yesterday Redmi officially presented the budget sub-flagship Redmi K70E, and today an unboxing of the device appeared on the Internet.

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

The photo shows a version of the Redmi K70E in Shadow Blue color – this is a shade of blue. How ITHome reviewers compare this color with jade.

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra
Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra
Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra
Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra
Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

The smartphone has a 6.67-inch screen with a very thin frame. Its width at the top and sides is only 1.3-1.35 mm – less than that of the iPhone 15 Pro. But at the bottom there is a larger frame – 2.27 mm.

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

The delivery set includes a branded case and a power supply that produces 90 W of power.

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

Unboxing and live photos of Redmi K70E - the first smartphone on SoC MediaTek Dimensity 8300-Ultra

Let us remind you that Redmi K70E became the first smartphone based on the MediaTek Dimensity 8300-Ultra single-chip system. It is more powerful than the Snapdragon 7 Plus Gen 2, and this should guarantee the Redmi K70E first place in the new AnTuTu sub-flagship rating (two models on the Snapdragon 7 Plus Gen 2 are currently in the lead).

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World’s Largest Auto Workers Strike Costs General Motors $9.3 Billion

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Worlds Largest Auto Workers Strike Costs General Motors 93 Billion

General Motors said its agreements with striking UAW and Canadian Unifor unions would increase costs by $9.3 billion through 2028. The company also announced a $10 billion share repurchase.

These data were announced after the signing of a new contract with the UAW, ratified earlier in November by a majority of 54.7% of the vote. The contract includes a 25 percent wage increase and future job security for union workers as they transition into electric vehicle production. The additional costs are about $575 per vehicle on top of the contract, which expires in 2028.

On Wednesday, November 29, GM said the six-week UAW strike had impacted its business, with earnings before interest and taxes estimated at $1.1 billion.

World's Largest Auto Workers Strike Costs General Motors $9.3 Billion

Image by Midjourney

“We are finalizing a 2024 budget that fully offsets the additional costs of our new labor agreements, and the long-term plan we are executing includes reducing the capital intensity of the business, developing products even more efficiently and further reducing our fixed and variable costs,” she said. CEO Mary Barra said in a statement. “With this clear path forward and our strong balance sheet, we will return significant capital to shareholders.”

The American automaker plans to immediately repurchase and retire $6.8 billion of its common stock as part of a $10 billion buyback program. The remainder of the buybacks will occur before 2024.

GM also announced a 33 percent increase in its common stock dividend, from 9 cents to 12 cents per quarter. The increase is expected to take effect in early 2024.

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