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Alexa-enabled Amazon TVs due in October

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Sources say American e-commerce giant Amazon is planning to launch a new line of private label smart TVs in the US. According to Business Insider, the TVs are slated to launch in early October.

The company sells smart TVs in India running the Fire OS operating system with screens of different diagonals. In January this year, the brand expanded its product range with three new models aimed at first-time buyers of smart TVs.

Business Insider, citing a well-informed source, confirms that Amazon’s new smart TVs will have Alexa voice assistant support. The line will be available in different sizes with screens from 55 to 75 inches. Most of the TVs under the Amazon brand are made by the Chinese company TCL, but this time one of the models will be made directly by Amazon.

Presumably, the company is going to launch TVs in the US, sold in India under the AmazonBasics brand. The 55-inch variant is expected to retail for around $ 600.

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MSI MEG CoreLiquid S High-Performance LSS Introduced

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MSI has unveiled the MEG CoreLiquid S series of liquid cooling systems developed in collaboration with Asetek. The series includes two models with aluminum radiators 280 mm and 360 mm long. The radiators are equipped with low-noise MSI MEG Silent Gale fans that turn on only when needed, and a 2.4-inch IPS display is built into the pump cover. The 7th generation Asetek pump features improved leakage resistance and increased durability.

The blades of the aforementioned fans are made of Liquid Crystal Polymer (LCP), a dense plastic with a low coefficient of thermal expansion. Their shape ensures maximum airflow. The rotor is supported by a hydrodynamic bearing to reduce noise and increase service life. Anti-vibration bushings are pressed in the corners of the fan frame. The rotation speed is adjustable in the range of 0-2000 rpm. The maximum speed corresponds to a flow of 95.54 m3/ h and a noise level of 22.7 dBA.

MSI MEG CoreLiquid S High Performance LSS Introduced

MSI MEG CoreLiquid S High Performance LSS Introduced

The dimensions of the water block with the pump installed on it are 95 x 95 x 54 mm. The display built into the pump cover can be configured to display various service information, graphic images or even MP4 video.

The list of compatible processor sockets includes Intel LGA 115x, 1200, 1700, 2011, 2011-3 and 2066 as well as AMD AM4, FM2 +, FM2, FM1, AM3 +, AM3, AM2 +, AM2, TR4, sTRX4, and SP3.

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Now it is clear why the bangs in the iPhone 13 Pro have become smaller. IFixit specialists disassembled the new product and assessed its maintainability

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IFixit specialists have published a complete material on the disassembly of the new iPhone 13 Pro. The smartphone received 5 points out of 10 possible for maintainability, which is a normal rating for a modern device made of glass and metal.

Disassembly clearly showed how much the cameras of the new iPhone are larger than last year. There are more sensors themselves and lenses.

Now it's clear why the bangs in the iPhone 13 Pro have become smaller.  IFixit specialists disassembled the new product and assessed its maintainability

iPhone 13 Pro left

The battery capacity is 11.97 Wh versus 10.78 Wh in the iPhone 12 Pro and 12.54 Wh in the iPhone 12 Pro Max.

Now it is clear why the bangs in the iPhone 13 Pro have become smaller.  IFixit specialists disassembled the new product and assessed its maintainability

The very compact motherboard houses the Apple A15 Bionic SoC, combined with 6 GB of RAM manufactured by Hynix, an Apple U1 module, an Apple APL1098 power controller, modules, Skyworks SKY58276-17 and Skyworks SKY58271-19, a Kiokia flash memory chip, a Qualcomm SDX60 5G modem and a number of other elements.

Now it is clear why the bangs in the iPhone 13 Pro have become smaller.  IFixit specialists disassembled the new product and assessed its maintainability

iPhone 13 Pro bottom

It is also clearly visible, due to which the notorious bangs have decreased. The components have become closer to each other and have slightly changed their location.

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Samsung twice rejected in the US for more chips for smartphones

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Samsung mobile head Tae Moon Roh (TM Roh) confirmed that he has made two work visits to the United States this year to obtain more stocks of chips and application processors needed to make smartphones.

According to TheElec, Tae Moon Ro met with major component manufacturers in the US to get more chips and asked major partners to increase shipments for the South Korean tech giant. However, according to sources close to this, the trips did not end as Samsung planned.

The first trip was made in March, the second took place in July. The source also added that the president of Samsung Mobile visited the headquarters of the global SoC maker in July and asked for additional chips, but was ultimately denied.

The component maker responded to Tae Moon Ro that the company also wants to increase its total supply, but cannot yet increase shipments for Samsung. The source adds that Tae Moon Ro was also accompanied by the vice president, who stayed in the United States after the division head’s visit and returned to South Korea after staying there for about three months.

However, a company spokesman said that their trips still cannot be called completely unsuccessful, since they really led to the fact that the brand was able to increase sales a little.

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