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Additional Add-On Cache for Ryzen Processors Will Not Create Heat Issues

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AMD showed off a prototype Ryzen 9 5900X processor yesterday with an added 64MB SRAM chip to act as additional L3 cache.

And this is not just a prototype – such CPUs will go into production at the end of this year, as announced yesterday by AMD itself, and later confirmed by third-party sources.

It is also now confirmed that we are talking about a CPU based on the Zen 3 architecture. Whether this means that Zen 3+ actually does not exist is unclear, but even without updating the architecture itself, 3D V-Cache technology will make the processors much faster. True, as already mentioned, only top CPUs with 12 and 16 cores will receive additional cache memory (128 MB).

We also now have some more details on this subject. For example, the additional cache can be disabled if necessary, which will have a positive effect on power consumption. Also, such a decision should not increase the delay.

The height of the processor with additional microcircuits will be the same as now in conventional CPUs. This will be achieved by reducing the thickness of both the chiplets and additional SRAM chips. In addition, since the additional microcircuit is located exactly above the native cache memory of the CPU, it does not hit the main heating points of the chiplet. Thus, there will be no problems with cooling.

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