The assortment of the Chinese company Ulefone has registered a new inexpensive smartphone Armor X6 Pro. Its feature is the maximum level of shell protection – IP69K: the phone does not let dust in and can withstand immersion in water to a depth of 1.5 m for 30 minutes. Also, the novelty meets the requirements of the American military standard MIL-STD-810G. Such a phone is suitable for builders, rescuers, participants in extreme hikes or expeditions.
For all these categories, performance is not the main thing, so the low-power MediaTek Helio A22 SoC with a built-in LTE modem was chosen as the basis for the smartphone. The 5-inch IPS screen is characterized by a resolution of 1280 x 720 pixels, the amount of operational and built-in flash memory, respectively, 4 and 32 GB. Also in the configuration are GPS and FM receivers, an NFC chip, a standard headphone jack, Wi-Fi 802.11ac and Bluetooth 5.0 modules.
The main camera is with a single 13-megapixel Sony IMX214 sensor, the front camera uses an OmniVision OV5670 image sensor with a resolution of 5 megapixels. The battery capacity was 4000 mAh, and it will take a very long time to charge, since the power is only 5 W (the connector, of course, is microUSB).
The phone runs Android 12 and can be controlled with gloves on. Dimensions and weight Armor X6 Pro – 150 x 78.9 x 14.4 mm and 227 grams. The price is 120 dollars.
Almost $5,000 for an Nvidia video card with a 256-bit bus, but 32 GB of memory. RTX 5000 Ada appeared in retail
Nvidia has launched the RTX 5000 Ada graphics adapter. This is a professional solution that should not be confused with the regular RTX 5000, since the latter is a previous generation model.
The RTX 5000 Ada has been available for about a month now, but previously it could only be purchased as part of ready-made workstations. Now it has appeared in retail, although so far, apparently, only in China.
There they ask for about $4,800 for a new product. This is about half the price of the RTX 6000 Ada, but the parameters of the younger model are simpler. The card offers an AD102 GPU, but with only 12,800 active CUDA cores. At the same time, the new product has 32 GB of memory, but a 256-bit bus. Performance (FP32) is 65.3 TFLOPS with a TDP of only 250 W.
Neither in Blender nor in V-Ray can the new Core i9-14900K outperform the “old” Ryzen 9 7950X
The results of testing the Core i9-14900K processor in tasks that can actually load modern multi-core processors have appeared on the Internet.
In Blender, the new product scores almost 560 points, which is 6% more than the Core i9-13900KS. This is good considering that these are technically identical CPUs. The new product is already 8% ahead of its direct predecessor, the Core i9-13900K. However, the Ryzen 9 7950X is still a little faster.
In V-Ray, the new Intel flagship showed a result of 27,790 points, ahead of the Core i9-13900KS by 5% and its predecessor by 8%. But here again the AMD flagship is ahead.
Of course, it was clear in advance that Raptor Lake Refresh would only be a very minor update (except for the Core i7, which will get more cores), but now we can verify this not only through the results from Geekbench.
The Ryzen 8000 and Ryzen 9000 processors will offer more cores than their predecessors. AMD roadmap describing Zen 5 and Zen 6 leaked online
An AMD roadmap has leaked online, describing a number of key features of the company’s future products. It was obtained by the author of the Moore’s Law Is Dead channel.
The document, among other things, describes the Zen 5 and Zen 6 architectures.
The first to hit the market, of course, will be Zen 5, codenamed Nirvana. The first CPUs based on it are expected in the first half of 2024. Processors with Zen 5 architecture will be produced using 3 and 4 nm technical processes and will bring an increase in IPC (the number of instructions executed per clock cycle) by 10-15%. It is also known that the data cache of Zen 5 will be increased to 48 KB, a new low-power core version will appear, and Zen 5 will also bring a 16-core cluster. Probably, only Zen 5c cores will be combined with 16 pieces, but this still means that the total number of cores in the new processors will increase and finally exceed the 16 pieces mark that we have become accustomed to since the Ryzen 3000.
Zen 6, codenamed Morpheus, is expected to move to 3nm and 2nm process technology and will be released sometime in 2025. The IPC indicator will increase by 10%, that is, not as much as in recent years. But the architecture will bring support for FP16 computing to accelerate AI/ML algorithms and a new memory profiler. Moreover, processor clusters will be able to have 32 cores each, which means that we will again see an increase in the number of cores in the CPU as a whole.
Moore’s Law Is Dead profiled many AMD products before they were released. In particular, the Radeon RX 7800 and Radeon RX 7700 video cards several months before the announcement.
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