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A new stage in the evolution of AMD processors. CPU Milan-X is the first company to get X3D hybrid layout



Back in 2015, before the first Epyc processors were released, AMD introduced the Exascale Heterogeneous Processor (EHP) concept with 32 cores and an integrated GPU with its own HBM memory. It never came out, but five years later AMD recalled the project, mentioning the X3D hybrid layout technology.

And now the first data on processors created on the basis of this technology has appeared on the Web. According to several sources, AMD is preparing processors codenamed Milan-X (3D), which will just rely on X3D technology. These will be server CPUs for data centers based on the Zen 3 architecture.

Based on what AMD showed earlier, in such CPUs, processor chiplets will be placed classically in the center, and memory chips will be placed one on one in four stacks at the edges. At the same time, one of the sources says that it is the processor chiplets that will be placed in stacks.

There are no other details yet, but given the Zen 3 architecture at the heart of such processors, we can assume that they will be released no later than next year.

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