As expected, today Redmi officially unveiled the Redmi 10 Prime “superstar” smartphone – an improved version of Redmi 10. The novelty debuted in India in two versions: with 4 GB of RAM and 64 GB of flash memory for $ 170 and with 6 GB of RAM and 128 GB of flash storage for $ 200.
The Redmi 10 Prime is equipped with a 6.5-inch IPS screen with a resolution of 2400 x 1080 pixels with a frame rate of 90 Hz and a front-facing camera embedded in the center. Fingerprint scanner – side, the display is protected by Gorilla Glass 3 tempered glass.
The hardware platform of the Redmi 10 Prime is the same as that of the Redmi 10 – both are built on the MediaTek Helio G88 12nm SoC. But for Redmi 10 Prime, support for the technology of expanding RAM is declared – by creating a virtual partition, it can be “increased” by 2 GB.
An 8MP sensor is installed in the front camera, and four sensors in the main camera. The main 50-megapixel lens is complemented by a fast lens with an aperture of F / 1.8. The 8-megapixel one looks at the world through a wide-angle lens with a viewing angle of 120 °, there are also a couple of 2-megapixel sensors for macro shooting and for analyzing the depth of the scene.
If the battery capacity of the Redmi 10 is 5000 mAh, then the Redmi 10 Prime received a 6000 mAh battery. The claimed autonomy is 723 hours of standby time, 192 hours of music playback, 24 hours of video playback, 11 hours of games or video recording. The smartphone supports 18W wired charging (although it comes with a 22.5W charger) and 9W reverse wired charging.
Also in the configuration are a microSD card slot, a USB-C port and a standard headphone jack, two microphones and two speakers, an IR emitter, Android 11 OS with MIUI 12.5 interface. The thickness is 8.92 mm, the weight is 192 grams. The Redmi 10 Prime has three color options: white, gradient blue and black.
Geely founder sets up a smartphone manufacturing venture
Chinese carmaker Geely, which owns Volvo, has announced that its chairman Eric Li, also known as Li Shufu, is setting up a new company that will make premium smartphones.
Founder Zhejiang Geely Holding’s new venture will aim to launch its first smartphone by 2023 and sell 3 million units in the first year.
Lee had previously made futuristic bets on ventures such as flying cars and helicopter taxis. In a smartphone market that is no longer growing in China, the new company will have to compete with Apple, Xiaomi and other established manufacturers.
Notably, smartphone makers are looking to enter the electric vehicle market, realizing that the smartphone boom is coming to an end. However, Geely is the first car manufacturer to try to move in the opposite direction.
The company said in a statement to Reuters that the new company will be called Hubei Xingji Shidai Technology Co Ltd and that it has already signed an agreement with the Wuhan Economic and Technological Development Zone to establish a headquarters in the central city of Wuhan. Li owns 55% of Xingji Shidai. The project will be financed with an investment of $ 1.55 billion.
Now it is clear why the bangs in the iPhone 13 Pro have become smaller. IFixit specialists disassembled the new product and assessed its maintainability
IFixit specialists have published a complete material on the disassembly of the new iPhone 13 Pro. The smartphone received 5 points out of 10 possible for maintainability, which is a normal rating for a modern device made of glass and metal.
Disassembly clearly showed how much the cameras of the new iPhone are larger than last year. There are more sensors themselves and lenses.
iPhone 13 Pro left
The battery capacity is 11.97 Wh versus 10.78 Wh in the iPhone 12 Pro and 12.54 Wh in the iPhone 12 Pro Max.
The very compact motherboard houses the Apple A15 Bionic SoC, combined with 6 GB of RAM manufactured by Hynix, an Apple U1 module, an Apple APL1098 power controller, modules, Skyworks SKY58276-17 and Skyworks SKY58271-19, a Kiokia flash memory chip, a Qualcomm SDX60 5G modem and a number of other elements.
iPhone 13 Pro bottom
It is also clearly visible, due to which the notorious bangs have decreased. The components have become closer to each other and have slightly changed their location.
Samsung twice rejected in the US for more chips for smartphones
Samsung mobile head Tae Moon Roh (TM Roh) confirmed that he has made two work visits to the United States this year to obtain more stocks of chips and application processors needed to make smartphones.
According to TheElec, Tae Moon Ro met with major component manufacturers in the US to get more chips and asked major partners to increase shipments for the South Korean tech giant. However, according to sources close to this, the trips did not end as Samsung planned.
The first trip was made in March, the second took place in July. The source also added that the president of Samsung Mobile visited the headquarters of the global SoC maker in July and asked for additional chips, but was ultimately denied.
The component maker responded to Tae Moon Ro that the company also wants to increase its total supply, but cannot yet increase shipments for Samsung. The source adds that Tae Moon Ro was also accompanied by the vice president, who stayed in the United States after the division head’s visit and returned to South Korea after staying there for about three months.
However, a company spokesman said that their trips still cannot be called completely unsuccessful, since they really led to the fact that the brand was able to increase sales a little.
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